Slabstock technology for demanding packaging applications

For the first time, Hennecke PUR Solutions will be exhibiting at interpack, the world’s leading trade fair for packaging machinery, packaging materials, and processing solutions. From May 7 to May 13, 2026, the company will present its portfolio of slabstock foam...

WAC2026 CALL FOR SPEAKERS

Submit your application and speak at the 2026 World Adhesive & Sealant Conference and EXPO. The most important event for the global adhesive and sealant community will gather industry leaders and stakeholders at the Queen Elisabeth II Centre, London, United...